We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for CMP Equipment.
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CMP Equipment Product List and Ranking from 4 Manufacturers, Suppliers and Companies | IPROS GMS

CMP Equipment Product List

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[Book] Trends in Advanced Semiconductor Manufacturing Processes and Miniaturization (No. 2220)

[Book] Trends in Advanced Semiconductor Manufacturing Processes and Miniaturization (No. 2220)

【Available for preview】 - Film formation technology, lithography, etching, CMP, cleaning -

Book Title: Latest Trends in Advanced Semiconductor Manufacturing Processes and Miniaturization Technologies --- ★ Amidst the calls for the limits of Moore's Law, how far will the development of miniaturization technologies continue? A comprehensive book covering the latest technologies in the "front-end" of advanced semiconductor manufacturing, where new structures and materials are being applied. --- ■ Key Points of This Book 1 - Latest trends in EUV lithography and the technical challenges of resists, masks, and light sources - The development history of metal resists that breaks conventional wisdom and future challenges - Recent development cases of atomic layer processes (ALD, ALE) that are rapidly gaining momentum in research and development - Latest trends in nanoimprint systems aimed at mass production applications for next-generation semiconductor memory devices - Latest trends in film deposition technologies and process optimization in semiconductor multilayer wiring - Cleaning performance required for advanced semiconductor manufacturing, the reality of contamination, and the latest cleaning technologies - Latest technologies and process control for high aspect ratio etching that enables the miniaturization of integrated circuits - CMP processes and consumable materials that respond to advancements in miniaturization and new materials, along with performance requirements for post-cleaning.

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  • others
  • CMP Equipment

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Introduction to GNC pattern wafer services and other contract processing services.

Introduction to GNC pattern wafer services and other contract processing services.

We can provide consistent production from substrate arrangement to mask design! Introducing the contract processing services of Global Net Co., Ltd., including pattern wafer services!

At Global Net Co., Ltd., we provide services such as GNC processing foundry and GNC patterned wafer services. We mainly offer processing services for silicon wafers, glass, and other materials tailored to our customers' needs. We are capable of providing integrated production from substrate arrangement to mask design. 【Business Overview】 ■ GNC Processing Foundry - Film deposition foundry - Process evaluation ■ GNC Patterned Wafer Services - GNC fine patterned wafers - GNC advanced CMP evaluation patterned wafers - GNC MEMS and silicon special processing services ■ GNC 2.1D/2.5D/3D Solutions - Bump wafer and redistribution processing / FOWLP process services *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract
  • Wafer processing/polishing equipment
  • CMP Equipment

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[Commissioned CMP] MAT Division

[Commissioned CMP] MAT Division

CMP process development, prototyping, and contract processing! With reliable technical skills and experience, we meet our customers' needs.

We would like to introduce our CMP/Dicing business, "MAT Division." We offer services such as "flattening," "smoothing," and "thinning (thin film)," not only in the semiconductor field but also for SiC power devices, SOI, micro-machines (MEMS), optical devices, LED sapphire, organic EL, and more. With our reliable technical expertise and experience, we respond to our customers' needs in advanced technologies such as "grinding," "lapping," "polishing," "CMP," and "cleaning." 【Features】 ■ CMP process development, prototyping, and contract processing ■ "Flattening," "smoothing," "thinning (thin film)" ■ Not limited to the semiconductor field ■ Responding to customer needs with reliable technical expertise and experience *For more details, please refer to the related link page or feel free to contact us.

  • Processing Contract
  • CMP Equipment

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CMP device [Desktop type for research and development, compatible with wafers up to 300mm!]

CMP device [Desktop type for research and development, compatible with wafers up to 300mm!]

We offer a lineup of CMP equipment ranging from tabletop models to those compatible with 300mm wafers! Customization and new designs are possible, including features like Dry-in/Dry-out!

We offer a lineup ranging from compact models suitable for research and development to models compatible with 300mm wafers. We can also propose specification changes, custom orders, and CMP automatic devices that allow for Dry-in / Dry-out according to your needs. We have demo units available, so we can conduct demo tests in your presence. 【We can also accommodate requests such as the following】 ■ Chemical compatibility (capable of handling various acidic and alkaline slurries) ■ Support for abrasive supply systems ■ Desire to include sensors to measure vibrations ■ Wanting to apply higher loads than usual ■ Wanting to measure temperature and humidity inside the device *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • CMP Equipment

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CMP device POLI-400

CMP device POLI-400

Leave it to us for double-sided grinding machines, polishing machines, and CMP equipment.

We have received high praise from customers in various fields for our grinding, polishing, cutting, and have developed technologies for flying line grinding, wrapping and polishing related equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid foundation of trust.

  • Other processing machines
  • Grinding Machine
  • CMP Equipment

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